Thinfilm to install NFC in Bericap plastic injection-molded closures

By Jenny Eagle contact

- Last updated on GMT

Bericap works to customize its products for customers. Photo: Bericap.
Bericap works to customize its products for customers. Photo: Bericap.

Related tags: NFC, Caps, Smart packaging

Bericap has partnered with ThinFilm Electronics to install its near field communications (NFC) technology in all its plastic injection-molded closures.

The technology will offer Bericap and its customers ‘a new dimension in brand protection’, that will add value to its broad portfolio of closures. 

Embed advanced chips

Capture

Together, the companies will help customers stay one step ahead of counterfeiters while adding connectivity for a variety of customer needs. 

Jörg Thiels, CEO, Bericap, said the collaboration will embed advanced chips into its closures to create dependable and cost-effective technology for brand protection and authentication purposes. 

This partnership with Thinfilm allows us to offer another important security and marketing tool for our customers in a range of markets​,” he said. 

Smart and anti-counterfeiting packaging technologies are fast developing requirements and Thinfilm’s technology and software platform is a perfect fit to further extend Bericap's extensive assortment of closures​.”  

Bericap, based in Budenheim, Germany, manufactures more than 84 billion plastic closures and dispensers every year. 

Consumer engagement

It has already started to integrate NFC into injection-molded plastic closures, with an easy-to-implement, integrated closure that supports brand protection, supply chain visibility, and consumer engagement. 

Thinfilm’s NFC OpenSense and SpeedTap products communicate wirelessly with NFC-enabled smartphones and can be applied to everyday objects via the CNECT cloud-based platform. 

Bericap is an important strategic partner for us​,” said Kevin Barber, CEO, Thinfilm, based in California, US. 

Fake products are not only a menace but also a safety risk and a danger to a brand’s reputation and its consumer relationships.​ 

We are looking forward to joining forces in developing product closures that will thwart the global problem of counterfeiting, refill fraud, tampering, and diversion​.”

AIPIA Summit

Siddharth Pandey, director, product management, ThinFilm Electronics, will be attending the AIPIA (Active & Intelligent Packaging Industry Association) Americas Summit​ in Jersey City, US, in June.  

He will be presenting the seminar: ‘Bringing Intelligence and Connectivity to Everyday Items’, on Monday, June 3, at 1:45pm to talk about how protecting your brand against tampering, refilling and imitations is important. 

Beyond protection from counterfeits, brands need to connect, influence and learn through consumer-initiated experiences. More touchpoints, visibility and relevancy let you move from a transactional experience to a relationship-based experience​,” he said.

Click here ​to register for the conference.

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